IC Packaging Design Engineer Job at Ferric Corporation

Ferric Corporation New York, NY 10001

As an IC Packaging Design Engineer, you will be part of an interdisciplinary engineering team working on all aspects of cutting-edge integrated voltage regulators. Your primary responsibilities will include the entire IC package design flow, including layout, parasitic extraction, optimization, tape-out, and bench validation.

Primary Responsibilities:

  • Work with IC design team to define IC package requirements

  • Design package layout using standard CAD tools

  • Extract package parasitics and conduct PI/SI analysis

  • Work with IC designers on power and signal integrity analyses of new power converter designs

Minimum Qualifications:

  • A Master's degree in Electrical Engineering, Physics or a related discipline

  • 5+ years experience with IC package design and design for manufacturing review

  • Experience with layout tools such as Cadence APD or Mentor Xpedition

  • Strong understanding of signal and power integrity fundamentals

  • Experience with standard electromagnetic FEA tools for package design

  • Understanding of RF characterization and S-parameters

  • Familiarity with BGA package substrate technologies

  • Experience with 2D/2.5D, 3D, and stacked die substrate design is a plus

  • Proficiency with Python and Matlab; Skill and Tcl experience is a plus

  • Experience with the Unix environment

Desired Characteristics & Attributes:

  • Excellent written and verbal communication skills required

  • Ability to work well with others in a fast-paced, collaborative team environment

Who we are:

  • Ferric is a technology startup based in New York City that is pioneering an entirely new approach to power delivery for integrated circuits and electronic assemblies. This approach leverages Ferric’s integration of thin-film magnetic inductors with CMOS semiconductor technology to enable a significant improvement in the integration density and efficiency of voltage regulators compared with existing technologies.

Location:

  • New York, NY

How to apply:

To apply for this position, send your resume and a cover letter to careers@ferricsemi.com

Ferric is unable to provide sponsorship for employment visa status for this position.




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